TY - GEN
T1 - A COT-based Highly Efficient Hybrid 3-Level Buck Converter for Next-Generation Memory Module Designs
AU - Kim, Ji Won
AU - Lee, Jeong Seop
AU - Lee, Kang Yoon
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper proposes the design of a useful COT-based high-efficiency Hybrid 3-Level Buck Converter for DRAM Memory Modules. The proposed Buck Converter can achieve an efficiency of 82.8%, surpassing the JEDEC efficiency spec of 82%, even when the DCR of the inductor increases from 10mΩ to 120mΩ. Additionally, it allows for a 75% reduction in the external inductor size, reducing it from 1008 to 0805. Consequently, the overall size of the PMIC block in the DDR5 Memory Module, which includes the PMIC, four inductors, and twelve bulk capacitors, can be reduced from 16.5 x 10.0 mm to 10.5 x 7.0 mm. This reduction in size enables an increase of up to 376uF (47uF 8ea) in the capacitance of High-Density Memory Modules, leading to improved power integrity (PI) performance of the entire Memory Module.
AB - This paper proposes the design of a useful COT-based high-efficiency Hybrid 3-Level Buck Converter for DRAM Memory Modules. The proposed Buck Converter can achieve an efficiency of 82.8%, surpassing the JEDEC efficiency spec of 82%, even when the DCR of the inductor increases from 10mΩ to 120mΩ. Additionally, it allows for a 75% reduction in the external inductor size, reducing it from 1008 to 0805. Consequently, the overall size of the PMIC block in the DDR5 Memory Module, which includes the PMIC, four inductors, and twelve bulk capacitors, can be reduced from 16.5 x 10.0 mm to 10.5 x 7.0 mm. This reduction in size enables an increase of up to 376uF (47uF 8ea) in the capacitance of High-Density Memory Modules, leading to improved power integrity (PI) performance of the entire Memory Module.
KW - DC-DC Buck Converter
KW - DRAM Memory Module
KW - High Efficiency
UR - https://www.scopus.com/pages/publications/85184797637
U2 - 10.1109/ISOCC59558.2023.10396438
DO - 10.1109/ISOCC59558.2023.10396438
M3 - Conference contribution
AN - SCOPUS:85184797637
T3 - Proceedings - International SoC Design Conference 2023, ISOCC 2023
SP - 11
EP - 12
BT - Proceedings - International SoC Design Conference 2023, ISOCC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International SoC Design Conference, ISOCC 2023
Y2 - 25 October 2023 through 28 October 2023
ER -