A CMOS envelope tracking power amplifier for 4G LTE mobile terminal applications

Junghyun Ham, Youngoo Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An envelope tracking power amplifier (ET PA) using a standard CMOS process for the 3GPP long-term evolution mobile terminals is presented. An efficiency of the CMOS power amplifier for the modulated signals can be improved combining with a highly efficient and wideband CMOS bias modulator. The CMOS PA has a two-stage differential common-source structure for high gain and large voltage swing. The bias modulator has a hybrid structure which consists of a linear stage and a switching stage. The variable load condition according to the envelope signal level is taken into account for the bias modulator design. By applying the bias modulator to the power amplifier, the ET PA delivers a PAE of 41.7 % at an average output power of 24 dBm, which is 5.3 % points higher than that of the power amplifier alone at the same average output power and linearity.

Original languageEnglish
Title of host publicationProceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1169-1171
Number of pages3
ISBN (Electronic)9781479943548
DOIs
StatePublished - 18 Dec 2014
Event3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014 - Harbin, China
Duration: 26 Jul 201429 Jul 2014

Publication series

NameProceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014

Conference

Conference3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014
Country/TerritoryChina
CityHarbin
Period26/07/1429/07/14

Keywords

  • bias modulator
  • CMOS power amplifier (PA)
  • Envelope tracking
  • hybrid buck converter
  • long term evlution (LTE)
  • power amplifier

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