A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx

Jihyun Cho, Jaehyuk Choi, Seong Jin Kim, Jungsoon Shin, Seokjun Park, James D.K. Kim, Euisik Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Scopus citations

Abstract

A 2D/3D image sensor with reconfigurable pixel array and column-level background suppression scheme is presented for high resolution outdoor imaging. The proposed pixel array employs pixel binning and superresolution techniques for adaptable resolution. The sensor achieved a 5.9μm pixel and was able to capture full resolution outdoor depth images under daylight over 100klx.

Original languageEnglish
Title of host publication2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers
PagesC6-C7
StatePublished - 2013
Externally publishedYes
Event2013 Symposium on VLSI Circuits, VLSIC 2013 - Kyoto, Japan
Duration: 12 Jun 201314 Jun 2013

Publication series

NameIEEE Symposium on VLSI Circuits, Digest of Technical Papers

Conference

Conference2013 Symposium on VLSI Circuits, VLSIC 2013
Country/TerritoryJapan
CityKyoto
Period12/06/1314/06/13

Fingerprint

Dive into the research topics of 'A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx'. Together they form a unique fingerprint.

Cite this