@inproceedings{927780ebf6b94c94bade68c5ffcbe726,
title = "A 32 Gb/s Full duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections",
abstract = "Leveraging advanced packaging technology can further improve chip integration by minimizing the dimensions of chip-to-chip interconnections at chiplet interfaces. Nonetheless, the escalation of crosstalk noise, driven by increased speed and routing density, poses a threat to chip functionality. This paper explores the effects of crosstalk in systems through channels with varied lengths and spacings. It also introduces a new high-speed bi-directional transceiver architecture designed to mitigate crosstalk in chiplets or systems featuring short channels and multiple inputs/outputs. Implemented using a 12-nm FinFET process, the proposed transceiver achieves an energy efficiency of 0.46 pJ/bit while operating at 32 Gb/s across a 5-mm channel with 1-μm spacing.",
keywords = "Bi-directional, Chip-to-chip, crosstalk cancellation, transceiver",
author = "Park, \{Jae Woo\} and Nicolas Pantano and \{Van Der Plas\}, Geert and Eric Beyne and Chun, \{Jung Hoon\}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 74th IEEE Electronic Components and Technology Conference, ECTC 2024 ; Conference date: 28-05-2024 Through 31-05-2024",
year = "2024",
doi = "10.1109/ECTC51529.2024.00172",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1072--1077",
booktitle = "Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024",
}
