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A 3-D camera with adaptable background light suppression using pixel-binning and super-resolution

  • Jihyun Cho
  • , Jaehyuk Choi
  • , Seong Jin Kim
  • , Seokjun Park
  • , Jungsoon Shin
  • , James D.K. Kim
  • , Euisik Yoon
  • University of Michigan, Ann Arbor
  • Samsung
  • Agency for Science, Technology and Research, Singapore

Research output: Contribution to journalArticlepeer-review

Abstract

This paper presents a CMOS time-of-flight (TOF) 3-D camera employing a column-level background light (BGL) suppression scheme for high-resolution outdoor imaging. The use of the column-level approach minimizes a pixel size for high-density pixel arrays. Pixel-binning and super-resolution can be adaptably applied for an optimal BGL suppression at given spatiotemporal resolutions. A prototype sensor has been fabricated by using 0.11 μm CMOS processes. The sensor achieved a fill factor of 24% in a pixel pitch of 5.9 μm which is the smallest among all the reported TOF cameras up to date. Measurement results showed the temporal noise of 1.47 cm-rms with a 100 ms integration time at a demodulation frequency of 12.5 MHz using a white target at 1 m distance. The non-linearity was measured as 1% over the range of 0.75 m ∼ 4 m. The BGL suppression over 100 klx was achieved from indoor and outdoor experiments, while the BGL-induced offset was maintained less than 2.6 cm under 0 ∼ 100 klx.

Original languageEnglish
Article number6873706
Pages (from-to)2319-2332
Number of pages14
JournalIEEE Journal of Solid-State Circuits
Volume49
Issue number10
DOIs
StatePublished - 1 Oct 2014
Externally publishedYes

Keywords

  • 3-D camera
  • Ambient light suppression
  • CMOS image sensor
  • background light suppression
  • demodulation pixel
  • pinned photodiode
  • pixel binning
  • superresolution
  • time-of-flight

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