TY - GEN
T1 - 7.2 A 48 ×4013.5 mm Depth Resolution Flash LiDAR Sensor with In-Pixel Zoom Histogramming Time-to-Digital Converter
AU - Kim, Bumjun
AU - Park, Seonghyeok
AU - Chun, Jung Hoon
AU - Choi, Jaehyuk
AU - Kim, Seong Jin
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/2/13
Y1 - 2021/2/13
N2 - 3D imaging technologies have become prevalent for diverse applications such as user identification, interactive user interfaces with AR/VR devices, and self-driving cars. Direct time-of-flight (D-ToF) systems, LiDAR sensors, are desirable for long-distance measurements in outdoor environments because they offer high sensitivity to weak reflected light and high immunity to background light thanks to the spatiotemporal correlation of SPADs [1], [2]. SPAD-based LiDAR sensors suffer from a large amount of ToF data generated by complicated time-to-digital converters (TDC), resulting in limited spatial resolution and frame rate compared with indirect ToF (I-ToF) sensors. Recently, LiDAR sensors embedding histogramming TDCs have been reported to generate depth information to reduce the required output bandwidth [3]-[6]. However, they still adopt a large number of memories in pixel, a complicated signal processor, or a column-parallel TDC scheme with scanning optics.
AB - 3D imaging technologies have become prevalent for diverse applications such as user identification, interactive user interfaces with AR/VR devices, and self-driving cars. Direct time-of-flight (D-ToF) systems, LiDAR sensors, are desirable for long-distance measurements in outdoor environments because they offer high sensitivity to weak reflected light and high immunity to background light thanks to the spatiotemporal correlation of SPADs [1], [2]. SPAD-based LiDAR sensors suffer from a large amount of ToF data generated by complicated time-to-digital converters (TDC), resulting in limited spatial resolution and frame rate compared with indirect ToF (I-ToF) sensors. Recently, LiDAR sensors embedding histogramming TDCs have been reported to generate depth information to reduce the required output bandwidth [3]-[6]. However, they still adopt a large number of memories in pixel, a complicated signal processor, or a column-parallel TDC scheme with scanning optics.
UR - https://www.scopus.com/pages/publications/85102382751
U2 - 10.1109/ISSCC42613.2021.9366022
DO - 10.1109/ISSCC42613.2021.9366022
M3 - Conference contribution
AN - SCOPUS:85102382751
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 108
EP - 110
BT - 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021
Y2 - 13 February 2021 through 22 February 2021
ER -