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3-D stacked image sensor with deep neural network computation

  • Mohammad Faisal Amir
  • , Jong Hwan Ko
  • , Taesik Na
  • , Duckhwan Kim
  • , Saibal Mukhopadhyay
  • Georgia Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

This paper investigates the power and performance trade-offs associated with integrating deep neural network (DNN) computation in an image sensor. The paper presents the design of Neurosensor-a CMOS image sensor with 3-D stacking of pixel array, read-out circuits, memory, and computing logic for DNN. The analysis shows integrating DNN reduces transmit latency (and energy), but at the expense of processing and memory access latency (and energy). Hence, given a specific DNN and transmission bandwidth, there exist an optimal number of layers that should be computed in the sensor to maximize energy-efficiency. In general, it is often more efficient to integrate memory within the sensor stack and/or implement only the feature extraction layers on the sensor, and optimized configurations can achieve up to 90× improvement in energy efficiency compared to the baseline. Further, coupled power, thermal, and noise simulation demonstrates that integrating DNN computation can increase pixel-array temperature resulting in higher noise, and hence, lower classification accuracy.

Original languageEnglish
Pages (from-to)4187-4199
Number of pages13
JournalIEEE Sensors Journal
Volume18
Issue number10
DOIs
StatePublished - 15 May 2018
Externally publishedYes

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • 3-D integration
  • hybrid memory cube
  • image sensors
  • neural networks
  • sensor noise
  • thermal analysis

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