Research output per year
Research output per year
Personal profile
Education
(Ph.D.) in Electrical Engineering, Stanford University, U.S.A. (2005)
Professional Experience
Professor, College of Information and Communication Engineering, Sungkyunkwan University, Suwon, Korea (2008.9 - Present)
Senior Member of Technical Staff, Rambus Inc., Los Altos, CA (2006-2008)
Circuit Design Engineer, Samsung Electronics, Gi-heung, Korea (2000-2001)
Fingerprint
Dive into the research topics where Jung-Hoon Chun is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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A 480×320 CMOS LiDAR Sensor with Tapering 1-Step Histogramming TDCs and Sub-Pixel Echo Resolvers
Roh, W., Piao, C., Jeon, T., Bae, J., Chun, J. H., Kim, S. J. & Choi, J., 2026, 2026 IEEE International Solid-State Circuits Conference, ISSCC 2026. Institute of Electrical and Electronics Engineers Inc., p. 118-120 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 69).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A 7-Level 18-Wire-State Trio-Signaling Transmitter for MIPI C-PHY 3.0 Interfaces
Lee, J., Oh, M., Kim, K. & Chun, J. H., 2026, In: IEEE Solid-State Circuits Letters. 9, p. 101-104 4 p.Research output: Contribution to journal › Article › peer-review
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A Fully Reconfigurable Hybrid SPAD Vision Sensor with 134dB Dynamic Range Using Time-Coded Dual Exposures
Hong, K., Kang, J., Hwang, J. H., Son, I., Park, S., Chun, J. H., Choi, J. & Kim, S. J., 2026, 2026 IEEE International Solid-State Circuits Conference, ISSCC 2026. Institute of Electrical and Electronics Engineers Inc., p. 124-126 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 69).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A Multi-Range, Multi-Resolution LiDAR Sensor with 2,880-Channel Modular Survival Histogramming TDC and Delay Compensation Using Double Histogram Sampling
Kim, M., Bae, J., Kim, D., Chun, J. H., Kim, S. J. & Choi, J., 2026, 2026 IEEE International Solid-State Circuits Conference, ISSCC 2026. Institute of Electrical and Electronics Engineers Inc., p. 116-118 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 69).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Comprehensive Comparison of Front- and Back-Illuminated Single-Photon Avalanche Diodes in 110 nm Standard CMOS Image Sensor Technology
Eom, D., Ha, W. Y., Park, E., Chun, J. H., Choi, J., Choi, W. Y. & Lee, M. J., Mar 2026, In: Sensors. 26, 5, 1664.Research output: Contribution to journal › Article › peer-review
Open Access
Press/Media
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Development of the nation’s first CMOS LiDAR Sensor System-on-Chip
Choi, J. H. & Chun, J.-H.
5/08/20
1 Media contribution
Press/Media