Research output per year
Research output per year
Personal profile
Education
학사:포항공대 재료공학과
석사:미국 스탠포드대학 재료공학과
박사:미국 스탠포드대학 재료공학과
Professional Experience
2000-2003:Lucent 연구원
2004-2005:예일대 연구원
Awards
Presidential Scholar Award, Microscopy Society of America, 1997
Recognition Award, Lucent Technologies, 2001
Active member of Materials Research Society(MRS)
Teaching award, Engineering school of Sungkyunkwan University, 2009&2013
Fingerprint
Dive into the research topics where Hoojeong Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Sintering behavior and mechanical properties of spark plasma-sintered ZrB2 with the addition of boron nitride nanotubes
Lee, S., Ahn, B., Lee, H., Jeong, H., Lee, H. J. & Ryu, S. S., Jan 2026, In: International Journal of Refractory Metals and Hard Materials. 134, 107453.Research output: Contribution to journal › Article › peer-review
-
Controlled Synthesis of Tellurium Nanowires and Performance Optimization of Thin-Film Transistors via Percolation Network Engineering
Park, M., Lyu, Z., Song, S. H. & Lee, H. J., Jul 2025, In: Nanomaterials. 15, 14, 1128.Research output: Contribution to journal › Article › peer-review
Open Access -
Crystal Plasticity-Based Modeling and Experimental Validation of the Influence of Microstructures and Grain Boundary Junction Types on the Cu-Cu Bonding Interface
Lee, J. U., Lee, H. D., Oh, S. H., Park, S. H., Cho, W. S., Park, Y. J., Haag, A., Watanabe, S., Arnold, M., Lee, H. J. & Lee, E., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1196-1200 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low-Temperature Cu-Cu Direct Bonding
Kim, G., Choi, S., Kwon, Y., Kim, S. E., Lee, H. J. & Park, Y. B., May 2025, In: Electronic Materials Letters. 21, 3, p. 429-442 14 p.Research output: Contribution to journal › Article › peer-review
-
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
Han, S. E., Choi, D. G., Han, S., Lee, T. Y., Han, D. G., Lee, H. J. & Yoo, S., Apr 2025, In: Materials. 18, 8, 1834.Research output: Contribution to journal › Article › peer-review
Open Access