Personal profile
Education
(Ph.D.) in Mechanical Engineering , KAIST, Korea (2015)
Professional Experience
Assistant Professor, 2020.01 – present, School of Mechanical Engineering, Sungkyunkwan University
Assistant Professor, 2017.09 – 2019.12, School of Mechanical & Control Engineering, Handong Global University
Research associate, 2016.01 – 2017.05, General Motors R&D U.S.A.
Postdoctoral Scholar, 2015.09 – 2016.02, KAIST
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Collaborations and top research areas from the last five years
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A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations
Park, J. H., Lee, E., Kim, I. D., Jung, H., Kim, J., Cho, J., Kim, J. H., Lee, T. I., Kang, S. K. & Lee, E. H., Apr 2026, In: Materials Science in Semiconductor Processing. 205, 110321.Research output: Contribution to journal › Review article › peer-review
Open Access2 Link opens in a new tab Scopus citations -
Microscale Tin–Bismuth Alloy Prepared via Cooling Rate Control as Anode Material for High-Performance Lithium-Ion Batteries
Park, H. S., Kim, T. H., Mohd Sarofil, A. D., Kim, M., Chung, K. Y., Lee, E. H. & Kim, J., 12 Jan 2026, In: Advanced Functional Materials. 36, 4, e14616.Research output: Contribution to journal › Article › peer-review
Open Access4 Link opens in a new tab Scopus citations -
Multi-scale computational approach to understand plasma assisted sulfidation for growth mechanism of MoS2
Cho, J., Kim, T. H., Kang, N., Lee, J., Woo, G., Shin, H., Han, S., Eom, G. W., Kim, H. U., Park, C., Choi, H., Kim, K., Lee, E. H. & Kim, T., 1 Jan 2026, In: Chemical Engineering Journal. 527, 171506.Research output: Contribution to journal › Article › peer-review
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A mathematical investigation of the influence of physical parameters on local surface heat flux of thin films
Oh, S. H., Choi, W. & Lee, E. H., Jun 2025, In: Journal of Engineering Mathematics. 152, 1, 4.Research output: Contribution to journal › Article › peer-review
Open Access -
An Effective 3D Thermal Network Integrated with Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns
Park, J. H., Kim, J., Jang, S., Mun, S. & Lee, E. H., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1589-1594 6 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
Press/Media
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Development of innovative platform based on artificial intelligence
16/10/24
1 Media contribution
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