Equipments Details
Description
The system integrates Ga FIB, SEM, and Ar ion beam technologies to minimize FIB-induced damage and enable high-precision sample preparation. It supports accelerating voltages from 0.5 to 30 kV for both FIB and SEM, with FIB achieving a maximum beam current of 100 nA and a resolution of 4 nm at 30 kV. The SEM provides high-resolution imaging at 2.8 nm (5 kV) and 3.5 nm (1 kV), facilitating precise observation.
Details
| Name | FIB 3 |
|---|---|
| Acquisition date | 1/04/18 |
| Manufacturers | Hitachi |
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